CIRCUIT SUPPORT FOR AN ELECTRONIC CIRCUIT, AND METHOD FOR MANUFACTURING A CIRCUIT SUPPORT OF SAID TYPE

The invention relates to a circuit support for an electronic circuit, comprising: - at least one conductor path (12); and - an insulating matrix (44) that is injection-molded over the at least one conductor path (12) in such a way as to leave open at least one first region (48) for connecting at least one electronic component (50) of the electronic circuit; the circuit support also comprises at least one fastening aid (16, 18, 22, 26, 28, 34, 36) that is/are made of the material (42) used for forming the insulating matrix (44) and/or the material of which the at least one conductor path (12) is made. The invention further relates to a method for manufacturing a corresponding circuit support. 本发明涉及种用于电子电路的电路载体，包括：至少个印制导线(12)；以及绝缘基体(44)，在空出用于连接电子电路的至少个电子组件(50)的至少个第区域(48)的情况下利用绝缘基体注塑包封至少个印制导线(12)；其中，电路载体包括至少个由用于绝缘基体(44)的材料(42)和/或至少个印制导线(12)的材料制成的固定辅助件(16、18、22、26、28、34、36)。本发明还涉及种用于制造相应的电路载体的方法。