APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES

An apparatus for processing wafer-shaped articles comprises a rotary chuck having a series of contact elements surrounding a wafer-shaped article when mounted on the rotary chuck. A non-rotating plateis positioned interiorly of the series of contact elements. The plate includes a gas supply that is...

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Bibliographische Detailangaben
Hauptverfasser:	BERNHARD LOIDL, MICHAEL BRUGGER, SHIHUNG KON, MILAN PLISHA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An apparatus for processing wafer-shaped articles comprises a rotary chuck having a series of contact elements surrounding a wafer-shaped article when mounted on the rotary chuck. A non-rotating plateis positioned interiorly of the series of contact elements. The plate includes a gas supply that is configured to supply gas so as to support a wafer-shaped article without contacting the non-rotating plate according to the Bernoulli principle. 本发明涉及种用于处理晶片状物品的装置，其包括：旋转卡盘，当晶片状物品被安装在旋转卡盘上时，该旋转卡盘具有围绕晶片状物品的系列接触元件。非旋转板位于系列接触元件的内部。该板包括气体供应装置，所述气体供应装置构造成供应气体，以便根据伯努利原理，在不接触非旋转板的情况下支撑所述晶片状物品。