Lanthanum hexaborid dispersion-strengthened copper-base contact material and preparation method thereof
The invention discloses a lanthanum hexaborid dispersion-strengthened copper-base contact material and a preparation method thereof. The lanthanum hexaborid dispersion-strengthened copper-base contactmaterial is a low-gas-content high-electricity-and-heat conduction uniform-microstructure LaB6 dispe...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a lanthanum hexaborid dispersion-strengthened copper-base contact material and a preparation method thereof. The lanthanum hexaborid dispersion-strengthened copper-base contactmaterial is a low-gas-content high-electricity-and-heat conduction uniform-microstructure LaB6 dispersion-strengthened CuCr alloy cylindrical ingot with the diameter 10-100 mm, the length-diameter ratio 0.1-2.0 and the compactness larger than 98.0%, and the LaB6 dispersion-strengthened CuCr alloy cylindrical ingot is formed through the steps that 64.4-68.6% of Cu, 27.6-29.4% of Cr and 2-8% of LaB6 powder are evenly mixed by weight and then sintered by discharge plasma. The prepared LaB6 dispersion-strengthened CuCr contact material has good voltage-resistant strength and electric-arc-corrosion-resistant performance and is wide in application prospect.
本发明公开了种六硼化镧弥散强化铜基触头材料及其制备方法,其是由Cu、Cr和LaB粉末按照质量百分比Cu 64.4%~68.6%、Cr 27.6%~29.4%、LaB2%~8%混合均匀后,再经放电等离子烧结而成的直径10~100mm、长径比0.1~2.0、致密度大于98.0%、低含气量、高导电导热、组织均匀的LaB弥散强化CuC |
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