Self-aligning pendulous reed for semiconductor chip
The invention discloses a self-aligning pendulous reed for a semiconductor chip, belongs to the field of the photoelectronic technique, and can be used for the placing and alignment of a semiconductorlight-emitting device chip. An alignment bar is set in the longitudinal direction of the surface of...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a self-aligning pendulous reed for a semiconductor chip, belongs to the field of the photoelectronic technique, and can be used for the placing and alignment of a semiconductorlight-emitting device chip. An alignment bar is set in the longitudinal direction of the surface of a silicon chip substrate, and the silicon chip substrate is provided with a series of etching slotswhich are the same. The etching slots are arranged in the lateral direction of the surface of the silicon chip substrate. A heat sink is placed on the silicon chip substrate, and an overturning plateis placed on the heat sink. A side edge of the heat sink is aligned with a side edge of a tube core placing in the etching slot. The pendulous reed is simpler in structure, and is lower in design andmanufacturing cost. The pendulous reed is simple, and does not need other redundant devices. The overall size of the pendulous reed is far less than the size of a conventional pendulous reed clampingtool, so the whole pendulous |
---|