Manufacturing method of target module
The invention provides a manufacturing method of a target module. The manufacturing method of the target module comprises the following steps: a tungsten titanium target blank and a copper back plateare provided, wherein a surface to be welded of the tungsten titanium target blank is a first welded...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention provides a manufacturing method of a target module. The manufacturing method of the target module comprises the following steps: a tungsten titanium target blank and a copper back plateare provided, wherein a surface to be welded of the tungsten titanium target blank is a first welded surface, and a surface to be welded of the copper back plate is a second welded surface; the firstwelded surface and the second welded surface are oppositely arranged and bonded to form an initial target module; and a hot isostatic pressing process is performed on the initial target module to obtain the target module. As the hot isostatic pressing process is performed on the initial target module, large-area welding of the tungsten titanium target blank and the copper back plate can be realized, the bonding strength of the tungsten titanium target blank and the copper back plate can be improved, the formed target module can reach the welding bonding rate of above 99% and the welding strength of above 50 MPa, and de |
---|