METHODS OF FORMING TRENCHES IN PACKAGES STRUCTURES AND STRUCTURES FORMED THEREBY

Methods of forming package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one interconnect structure disposed on a peripheral region of the first substrate. A molding compound is disposed on a portion of the first substrate and on the first die, wherein a trench opening is disposed in the molding compound that is locatedbetween the at least one interconnect structure and the first die. 描述了形成包括沟槽的封装结构的方法。实施例包括设置在第衬底上的第管芯和设置在第衬底的外围区上的至少个互连结构。模制化合物设置在第衬底的部分上和第管芯上，其中沟槽开口设置在位于至少个互连结构与第管芯之间的模制化合物中。