FLOODING DEVICE FOR HORIZONTAL GALVANIC OR WET-CHEMICAL PROCESS LINE FOR METAL DEPOSITION ON SUBSTRATE

The present invention is related to a flooding device for a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated, wherein the flooding device comprises at least a flooding element and at least a first substrate guiding element, wherein said flooding element is mechanically connected to the at least first substrate guiding element, and wherein the first substrate guiding element is spatially arranged on the entry side of the flooding element. The present invention is further related to a treating module of a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated comprising at least one pair of oppositely arranged such flooding devices. 本发明涉及种用于在待处理的衬底上进行金属沉积、特别是铜沉积的水平电流或湿式化学工艺线的放流装置，其中所述放流装置包括至少放流元件及至少第衬底导引元件，其中所述放流元件机械连接到所述至少第衬底导引元件，且其中所述第衬底导引元件在空间上布置于所述放流元件的入口侧上。本发明进步涉及种用于在待处理的衬底上进行金属沉积、特别是铜沉积的水平电流或湿式化学工艺线的处理模块，所述处理模块包括至少对经相对布置的此类放流装置。