Micromechanical spring device, and method for producing a micromechanical spring device
The invention relates to a micromechanical device and to a corresponding production method. The device is formed with a micromechanical device (10) comprising a spring device (16; 216; 316; 416; 516)which is coupled or can be movably coupled to a frame device (14) at at least one attachment point (2...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a micromechanical device and to a corresponding production method. The device is formed with a micromechanical device (10) comprising a spring device (16; 216; 316; 416; 516)which is coupled or can be movably coupled to a frame device (14) at at least one attachment point (24-i; 124) of the spring device (16); wherein the spring device (16; 216; 316; 416; 516) has at least one web (18-i; 218-i; 318-i; 518-1) which extends from the at least one attachment point (24-i; 124), and the at least one web (18-i; 218-i; 318-i; 518-1) is structured so as to have at least one first section (20-i; 220-i) and at least one widened section (22-i; 222-i; 522) for reducing a nonlinearity of the spring device (16), said widened section being widened compared to the first section (20-i; 220-i).
本发明提供种微机械设备以及种相应的制造方法。所述设备构造具有:微机械设备(10),具有:弹簧装置(16;216;316;416;516),所述弹簧装置在所述弹簧装置(16)的至少个附接点(24-i;124)以能运动的方式能耦接到或者已耦接到框架装置(14)上;其中,所述弹簧装置(16;216;316;416;516)具有至少个接片(18-i;218-i;318-i;518-1),所述至少个接片从所述至少个附接点(24-i |
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