Assembly method of TR assembly
The embodiment of the invention relates to an assembly method of a TR assembly. The method comprises the steps of carrying out cleaning treatment on a microstrip plate and a carrier drying the cleanedmicrostrip plate and the cleaned carrier to obtain a treated microstrip plate and a treated carrier;...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention relates to an assembly method of a TR assembly. The method comprises the steps of carrying out cleaning treatment on a microstrip plate and a carrier drying the cleanedmicrostrip plate and the cleaned carrier to obtain a treated microstrip plate and a treated carrier; welding the treated microstrip plate and the treated carrier to obtain a carrier assembly; weldinga joint on the carrier assembly according to a preset joint brazing rule to obtain a brazed carrier assembly; assembling components and heat sink on the brazed carrier assembly according to a presetassembly rule to obtain a pretreated TR assembly; carrying out wire bonding treatment on the pretreated TR assembly through gold wire wedge bonding equipment to obtain a wire-bonded TR assembly; and carrying out sealing treatment on the wire-bonded TR assembly through laser sealing equipment to obtain the TR assembly. Through the assembly method provided by the embodiment of the invention, the technical effect of efficientl |
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