Semiconductor package device and method of manufacturing the same

A semiconductor package device comprises: a first die having a first surface and a second surface opposite to the first surface; and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further comprises an encapsulant layer encapsulating the first die and the first adhesive layer; and a first conductive via disposed in the first adhesive layer and electrically connected to the first die. 种半导体封装装置包含：第裸片，其具有第表面和与所述第表面相对的第二表面；以及第粘合剂层，其安置于所述第裸片的所述第表面上。所述半导体封装装置进步包含：囊封剂层，其囊封所述第裸片和所述第粘合剂层；以及第导电通孔，其安置在所述第粘合剂层中且电连接到所述第裸片。