Semiconductor device and imaging device

The present invention improves the joint strength between semiconductor chips. In this semiconductor device, a first semiconductor chip is provided with a first joining surface having a first insulating layer, a plurality of first pads to which is electrically connected a first inner layer circuit w...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOTOO KENGO, KOIKE KAORU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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