Non-planar flat heat pipe heat dissipation structure applicable to aerospace electronic equipment

The invention discloses a non-planar flat heat pipe heat dissipation structure applicable to aerospace electronic equipment. The structure comprises a heat dissipation substrate, a miniature heat pipecover plate, a miniature heat pipe, a cold end and a cold end cover plate. The heat dissipation subs...

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Bibliographische Detailangaben
Hauptverfasser: SUN ZHIJIAN, HU YACAI, CHENG GONG, YU ZITAO, QIAN WENYING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a non-planar flat heat pipe heat dissipation structure applicable to aerospace electronic equipment. The structure comprises a heat dissipation substrate, a miniature heat pipecover plate, a miniature heat pipe, a cold end and a cold end cover plate. The heat dissipation substrate and the miniature heat pipe cover plate are of plate structures, heat sources can be arrangedon the plate structures, and the substrate is provided with a groove used for installing the miniature heat pipe; the miniature heat pipe is of a flat bent structure, adopts a channel wick and is bent at a heat insulating section; the cold end is directly integrated with an electronic equipment shell, and dissipates heat via a large heat capacity shell, and the cold end cover plate is used for fixing the miniature heat pipe. According to the structure provided by the invention, aiming at different heat source distribution manners, an aslant bending type flat heat pipe and a double-sided direct bending type flat heat p