Bonding system

Bonding system

The present disclosure provides a bonding system capable of shortening a processing time for transferring first and second substrates to a bonding apparatus. According to one embodiment of the presentdisclosure, the bonding system includes a substrate transfer device configured to transfer a first s...

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Hauptverfasser: SHOGO HARA, TAKAHIRO MASUNAGA, MASATAKA MATSUNAGA, MASAAKI UMITSUKI, TAKASHI KOGA, FUMIO SAKATA, KAZUTOSHI ISHIMARU, YASUTAKA SOMA
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SHOGO HARA
TAKAHIRO MASUNAGA
MASATAKA MATSUNAGA
MASAAKI UMITSUKI
TAKASHI KOGA
FUMIO SAKATA
KAZUTOSHI ISHIMARU
YASUTAKA SOMA
description The present disclosure provides a bonding system capable of shortening a processing time for transferring first and second substrates to a bonding apparatus. According to one embodiment of the presentdisclosure, the bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus for bonding the first substrate and the second substrate; a first holding plate configured to hold the first substrate from an upper surface side; and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side; and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side so that the second substrate faces the first substrate. The first
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Bonding system
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