Bonding system
The present disclosure provides a bonding system capable of shortening a processing time for transferring first and second substrates to a bonding apparatus. According to one embodiment of the presentdisclosure, the bonding system includes a substrate transfer device configured to transfer a first s...
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| Hauptverfasser: | , , , , , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present disclosure provides a bonding system capable of shortening a processing time for transferring first and second substrates to a bonding apparatus. According to one embodiment of the presentdisclosure, the bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus for bonding the first substrate and the second substrate; a first holding plate configured to hold the first substrate from an upper surface side; and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side; and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side so that the second substrate faces the first substrate. The first |
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