Method for cutting brittle material base plate

The embodiment of the invention provides a method for cutting a brittle material base plate, and applied to a laser cutting device. The laser cutting device comprises a control unit, a laser transmitting device and a working platform, wherein the laser transmitting device and the working platform are electrically connected with the control unit and opposite to each other. The brittle material baseplate to be cut is carried on the working platform. The method includes the steps that a received laser cutting instruction is responded, the control unit controls the working platform and the lasertransmitting device to move relatively and meanwhile controls the laser transmitting device to emit a laser beam periodically to a preset area of the brittle material base plate to be cut in order toform gap array in the preset area, and the width of the gap array in the direction perpendicular to the motion direction of the relative motion is between 10 [mu]m and 300 [mu]m. 本发明实施例提供了种切割脆性材料基板的方法，应用于激光切割设备，所述激光切割设备包括控制单元以及