Heat dissipation method of LED display screen

The invention discloses a heat dissipation method of an LED (light emitting diode) display screen. Firstly, an air inlet groove, heat conduction spacers, a servo motor, a rotating shaft and fan bladesare arranged to realize the heat dissipation of a PCB and the display screen. The U-shaped heat cond...

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Bibliographische Detailangaben
1. Verfasser:	YANG HANGJIE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The invention discloses a heat dissipation method of an LED (light emitting diode) display screen. Firstly, an air inlet groove, heat conduction spacers, a servo motor, a rotating shaft and fan bladesare arranged to realize the heat dissipation of a PCB and the display screen. The U-shaped heat conduction spacers separate the front and rear cavities of the PCB, so that the air entering through the air inlet groove is uniformly distributed between the heat conduction spacers. Therefore, the uniform heat dissipation of the PCB is facilitated. The situation that the PCB or the display screen isscrapped due to local overheating is avoided. Secondly, a heat dissipation box, a partition plate, a spray head, a water inlet pipe, a heat dissipation pipe, a water feeding pipe and a booster pump are arranged to realize the water cooling and the heat dissipation in a cavity between the PCB and the heat dissipation box. The water gets in contact with the front side surface of the inner cavity ofthe heat dissipation box to