OLED (organic light-emitting diode) device packaging device and OLED device packaging method

The invention discloses an OLED (organic light-emitting diode) device packaging device and an OLED device packaging method. The OLED device packaging method includes the steps: preheating glass cementon an OLED device; performing laser sintering on the glass cement by a laser head; annealing the glass cement after laser sintering. By the packaging method, the temperature of the glass cement before laser sintering and after laser sintering can be controlled, and sudden temperature change of the glass cement is prevented. 本发明公开种OLED器件封装装置及OLED器件的封装方法，OLED器件的封装方法包括以下步骤：对OLED器件上的玻璃胶进行预热；使用激光头对玻璃胶进行激光烧结；对激光烧结后的玻璃胶进行退火。该封装方法能够对在激光烧结前和激光烧结后的玻璃胶进行温控，防止玻璃胶出现温度骤然变化。