Laminated, leak-resistant chemical processors, methods of making, and methods of operating

The invention provides methods of making laminated devices (especially microchannel devices) in which plates are assembled and welded together. Unlike conventional microchannel devices, the inventivelaminated devices can be made without brazing or diffusion bonding; thus providing significant advantages for manufacturing. Features such as expansion joints and external welded supports are also described. Laminated devices and methods of conducting unit operations in laminated devices are also described. 本发明提供制作层压装置(特别是微通道装置)的方法，其中板被组装并焊接在起。与常规微通道装置不同，本发明的层压装置可在无钎焊或扩散结合的情况下制作；从而为制造提供明显的优势。还描述了如膨胀接头和外部焊接支撑件等特征。还描述了层压装置以及在层压装置中进行单元操作的方法。