High-frequency microwave multilayer circuit board resin plug hole method

The present invention provides a high-frequency microwave multilayer circuit board resin plug hole method. The method comprises the following steps: S1, high-frequency microwave multilayer circuit board boring: employing a drill pin to perform boring of a preset boring position of a high-frequency microwave multilayer circuit board, and forming a through hole; S2, copper deposition: inducting a chemical copper deposition self-catalyzed reaction through activation of a palladium core, and performing deposition of chemical copper at the inner wall of the through hole; S3, resin plug hole: performing uniform mixing of ceramic powder and epoxy resin according to a weight ratio of 8-12:1 at a temperature of 40-50 DEG C, performing ultrasonic mixing for 30 minutes, obtaining a resin mixture, injecting the resin mixture into the through hole an opening at the lower end of the through hole and provided with a pad, and allowing the resin mixture and the opening at the upper end of the through hole to be flush; and S4,