Adhesive tape for mold release

An adhesive tape for mold release, the adhesive tape having at least a fluorine resin film 1, which constitutes a mold-release surface, and an adhesive layer 2 and, as desired, having an application tape 3 and a peel-off liner 4. The adhesive tape is characterized in that the adhesive layer 2 comprises an adhesive composition that has a type OO durometer hardness, as defined by ASTM D2240, of 60 or higher at 23DEG C and of 30 or higher at 150DEG C. Rough marks are not left on the mold-release surface of the tape even if the tape is hot pressed at high-temperatures, and molded articles that have a favorable appearance can be obtained even if the articles are molded continuously. 本发明公开了种脱模用粘着带，其即使在高温下进行热压，带的脱模面也不带有凹凸痕，且即使直接连续成型也可获得具有良好外观的成型品，该脱模用粘着带为至少具有用于构成脱模面的氟树脂系膜(1)和粘着剂层(2)，且根据期望具有定位带(3)和剥离衬里(4)的脱模用粘着带，其特征在于，粘着剂层(2)由ASTM D 2240所规定的00类计示硬度在23℃为60以上且在150℃为30以上的粘着剂组合物构成。