Printed circuit board including a thick-wall via and method of manufacturing same

The invention provides a printed circuit board including a thick-wall via and a method of manufacturing the same. The method includes providing a printed circuit board (PCB) substrate including at least one insulating layer and first and second conductive layers separated from one another by the at...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: ROESSLER ROBERT JOSEPH
Format: Patent
Sprache:chi ; eng
Schlagworte:
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