Printed circuit board including a thick-wall via and method of manufacturing same

The invention provides a printed circuit board including a thick-wall via and a method of manufacturing the same. The method includes providing a printed circuit board (PCB) substrate including at least one insulating layer and first and second conductive layers separated from one another by the at least one insulating layer, forming a first via hole in the PCB substrate extending from the first conductive layer to the second conductive layer, where the first via hole is defined by a first sidewall of the PCB substrate, forming a second via hole in the PCB substrate, where the second via hole is defined by a second sidewall of the PCB substrate, and selectively plating the first sidewall and the second sidewall to form a first via and a second via, respectively, where the first via and the second via have different via sidewall thicknesses. 本发明提供种包括厚壁通孔的印刷电路板及其制造方法，所述方法包括：提供印刷电路板(PCB)衬底，所述印刷电路板衬底包括至少个绝缘层以及第导电层和第二导电层，所述第导电层和第二导电层通过所述至少个绝缘层彼此隔开；在所述PCB衬底中形成第导通孔，所述第导通孔从所述第导电层延伸到所述第二导电层，其中所述第导通孔由所述PCB衬底的第侧壁限定；在所述P