Processing method and system for nanometer injection molding part

The embodiment of the invention discloses a processing method and system for a nanometer injection molding part. The processing method of the nanometer injection molding part comprises the steps that a first elastic piece is subjected to T treatment; the first elastic piece subjected to T treatment...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	REN JIANCAI, LI ZHIPENG, FAN WEILEI, GAO AIHUI, QIN GUANTAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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