Processing method and system for nanometer injection molding part
The embodiment of the invention discloses a processing method and system for a nanometer injection molding part. The processing method of the nanometer injection molding part comprises the steps that a first elastic piece is subjected to T treatment; the first elastic piece subjected to T treatment...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention discloses a processing method and system for a nanometer injection molding part. The processing method of the nanometer injection molding part comprises the steps that a first elastic piece is subjected to T treatment; the first elastic piece subjected to T treatment is subjected to nanometer injection molding treatment with a second elastic piece to form the nanometer injection molding part; the nanometer injection molding part is subjected to electropolishing treatment; and the nanometer injection molding part subjected to electropolishing treatment is subjected to plating treatment. According to the processing method and system for the nanometer injection molding part, the technical problem that as for a nanometer injection molding technology at the present stage, a plating layer of an injection molding part is prone to being damaged so that the use reliability of a product cannot be ensured is solved.
本发明实施例公开了种纳米注塑件加工方法及其加工系统,其方法包括:对第弹片进行T处理;对T处理后的第弹片与第二弹片进行纳米注塑处理形成纳米注塑件;对 |
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