Method for plating copper bottoming layer on steel roller
The invention relates to a method for plating a copper bottoming layer on a steel roller. Sulfuric acid is used for conducting activating treatment on a plate roller. The plate roller serves as a cathode, soluble phosphorus-containing copper serves as an anode, the plate roller and the soluble phosp...
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| creator | QIN XINFENG XUE XILE |
| description | The invention relates to a method for plating a copper bottoming layer on a steel roller. Sulfuric acid is used for conducting activating treatment on a plate roller. The plate roller serves as a cathode, soluble phosphorus-containing copper serves as an anode, the plate roller and the soluble phosphorus-containing copper are placed in an electroplating solution, the temperature is controlled to range from 25 DEG C to 40 DEG C, the electroplating current density is controlled to range from 3 A/dm to 6 A/dm , electroplating is conducted for 420 s to 480 s, and the copper bottoming layer is electroplated on the plate roller. Compared with the prior art, combination between the plating layer and a steel body is good, the copper plating layer is 300 microns, no scaling and disengaging exist through folding tests, ultra-high combination force is achieved, plating layer crystals are delicate, levelness is obviously superior than that of a nickel layer, and the production efficiency can also be improved.
本发明涉及种在钢辊上镀 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN107502928A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN107502928A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN107502928A3</originalsourceid><addsrcrecordid>eNrjZLD0TS3JyE9RSMsvUijISSzJzEtXSM4vKEgtUkjKLynJzwUJ5CRWAvn5eQrFJampOQpF-Tk5qUU8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_QwNzUwMjSyMLRmBg1AEW7Lr4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for plating copper bottoming layer on steel roller</title><source>esp@cenet</source><creator>QIN XINFENG ; XUE XILE</creator><creatorcontrib>QIN XINFENG ; XUE XILE</creatorcontrib><description>The invention relates to a method for plating a copper bottoming layer on a steel roller. Sulfuric acid is used for conducting activating treatment on a plate roller. The plate roller serves as a cathode, soluble phosphorus-containing copper serves as an anode, the plate roller and the soluble phosphorus-containing copper are placed in an electroplating solution, the temperature is controlled to range from 25 DEG C to 40 DEG C, the electroplating current density is controlled to range from 3 A/dm to 6 A/dm , electroplating is conducted for 420 s to 480 s, and the copper bottoming layer is electroplated on the plate roller. Compared with the prior art, combination between the plating layer and a steel body is good, the copper plating layer is 300 microns, no scaling and disengaging exist through folding tests, ultra-high combination force is achieved, plating layer crystals are delicate, levelness is obviously superior than that of a nickel layer, and the production efficiency can also be improved.
本发明涉及种在钢辊上镀</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171222&DB=EPODOC&CC=CN&NR=107502928A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171222&DB=EPODOC&CC=CN&NR=107502928A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QIN XINFENG</creatorcontrib><creatorcontrib>XUE XILE</creatorcontrib><title>Method for plating copper bottoming layer on steel roller</title><description>The invention relates to a method for plating a copper bottoming layer on a steel roller. Sulfuric acid is used for conducting activating treatment on a plate roller. The plate roller serves as a cathode, soluble phosphorus-containing copper serves as an anode, the plate roller and the soluble phosphorus-containing copper are placed in an electroplating solution, the temperature is controlled to range from 25 DEG C to 40 DEG C, the electroplating current density is controlled to range from 3 A/dm to 6 A/dm , electroplating is conducted for 420 s to 480 s, and the copper bottoming layer is electroplated on the plate roller. Compared with the prior art, combination between the plating layer and a steel body is good, the copper plating layer is 300 microns, no scaling and disengaging exist through folding tests, ultra-high combination force is achieved, plating layer crystals are delicate, levelness is obviously superior than that of a nickel layer, and the production efficiency can also be improved.
本发明涉及种在钢辊上镀</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD0TS3JyE9RSMsvUijISSzJzEtXSM4vKEgtUkjKLynJzwUJ5CRWAvn5eQrFJampOQpF-Tk5qUU8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_QwNzUwMjSyMLRmBg1AEW7Lr4</recordid><startdate>20171222</startdate><enddate>20171222</enddate><creator>QIN XINFENG</creator><creator>XUE XILE</creator><scope>EVB</scope></search><sort><creationdate>20171222</creationdate><title>Method for plating copper bottoming layer on steel roller</title><author>QIN XINFENG ; XUE XILE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN107502928A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>QIN XINFENG</creatorcontrib><creatorcontrib>XUE XILE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QIN XINFENG</au><au>XUE XILE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for plating copper bottoming layer on steel roller</title><date>2017-12-22</date><risdate>2017</risdate><abstract>The invention relates to a method for plating a copper bottoming layer on a steel roller. Sulfuric acid is used for conducting activating treatment on a plate roller. The plate roller serves as a cathode, soluble phosphorus-containing copper serves as an anode, the plate roller and the soluble phosphorus-containing copper are placed in an electroplating solution, the temperature is controlled to range from 25 DEG C to 40 DEG C, the electroplating current density is controlled to range from 3 A/dm to 6 A/dm , electroplating is conducted for 420 s to 480 s, and the copper bottoming layer is electroplated on the plate roller. Compared with the prior art, combination between the plating layer and a steel body is good, the copper plating layer is 300 microns, no scaling and disengaging exist through folding tests, ultra-high combination force is achieved, plating layer crystals are delicate, levelness is obviously superior than that of a nickel layer, and the production efficiency can also be improved.
本发明涉及种在钢辊上镀</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Method for plating copper bottoming layer on steel roller |
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