Method for plating copper bottoming layer on steel roller

The invention relates to a method for plating a copper bottoming layer on a steel roller. Sulfuric acid is used for conducting activating treatment on a plate roller. The plate roller serves as a cathode, soluble phosphorus-containing copper serves as an anode, the plate roller and the soluble phosphorus-containing copper are placed in an electroplating solution, the temperature is controlled to range from 25 DEG C to 40 DEG C, the electroplating current density is controlled to range from 3 A/dm to 6 A/dm , electroplating is conducted for 420 s to 480 s, and the copper bottoming layer is electroplated on the plate roller. Compared with the prior art, combination between the plating layer and a steel body is good, the copper plating layer is 300 microns, no scaling and disengaging exist through folding tests, ultra-high combination force is achieved, plating layer crystals are delicate, levelness is obviously superior than that of a nickel layer, and the production efficiency can also be improved. 本发明涉及种在钢辊上镀