EPOXY RESIN COMPOSITION COMPRISING AM-CPDA AS HARDENER

The invention relates to an epoxy resin composition comprising AM-CPDA (2-(3-(Aminomethyl)-3,5,5-trimethylcyclohexyl) propane-1,3-diamine) as a curing agent.as hardener. The invention relate to the use of preparing a composite material with the epoxy resin composition. 本发明涉及包含AM-CPDA（2-(3-(氨基甲基)-3,5...

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Bibliographische Detailangaben
Hauptverfasser:	JACLYN BALTHASAR, ANNE RITTSTEIGER, ALEXANDER MARTIN RUEFER, JOERG-JOACHIM NITZ, EIKE LANGKABEL, MARTINA ORTELT, DIRK FUCHSMANN, STEPHAN KOHLSTRUK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The invention relates to an epoxy resin composition comprising AM-CPDA (2-(3-(Aminomethyl)-3,5,5-trimethylcyclohexyl) propane-1,3-diamine) as a curing agent.as hardener. The invention relate to the use of preparing a composite material with the epoxy resin composition. 本发明涉及包含AM-CPDA（2-(3-(氨基甲基)-3,5,5-三甲基环己基)丙烷-1,3-二胺）作为固化剂的环氧树脂组合物。本发明还涉及所述环氧树脂组合物用于制备复合材料的用途。