Double-layer stacking hermetic packaging structure and method

The present invention provides a double-layer stacking hermetic packaging structure and method. On the basis of film circuit wafer substrate routine circuit and design, a shielding ring belt formed through processing of clearance holes at the periphery of an original functional circuit is arranged; the structure comprises a ground bonding pad which is arranged along the shielding ring belt to form an air tightness welding area; the structure also comprises a packaging cover plate with a size corresponding to the size of the film circuit wafer substrate, the packaging cover plate is made of a ceramic substrate, the shielding ring belt and the ground bonding pad corresponding to the film circuit wafer substrate are arranged at the front surface of the packaging cover plate to realize peripheral air tightness in the later assembling process; the back surface of the film circuit wafer substrate and the back surface of the packaging cover plate are provided with ground zones; and the ground bonding pad is connecte