Chip package, a method of manufacturing a chip package, a method of operating a chip package and a chip package system

A chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package including: a first sensor configured to measure a magnetic field component up to a maximum magnetic field value; a second sensor configured to measure the magnetic field component beyond the maximum magnetic field value; and a circuit coupled to the first sensor and the second sensor and configured to receive at least one sensor signal from at least one of the first sensor and the second sensor, wherein the circuit is further configured to select the first sensor or the second sensor to measure the magnetic field component based on the received sensor signal. 公开了种芯片封装体、种芯片封装系统、种制造芯片封装体的方法和种操作芯片封装体的方法，所述芯片封装体包括：被构造成测量最大为最大磁场值的磁场分量的第传感器；被构造成测量超过最大磁场值的磁场分量的第二传感器；以及藕接到第传感器和第二传感器且被构造成从第传感器和第二传感器中的至少个接收至少个传感器信号的电路，其中，所述电路被进步构造成基于接收到的传感器信号选择第传感器或第二传感器来测量磁场分量。