SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

In order to solve the problem of satisfactorily removing a resist from the surface of a substrate, the present invention is a substrate processing device (1) having a spin chuck (5) and an SPM feed unit (6) for feeding SPM to the substrate (W) held by the spin chuck (5), wherein the SPM feed unit (6) includes a mixing unit (30) for mixing an aqueous hydrogen peroxide solution and hydrofluoric acid and producing a liquid mixture of hydrogen peroxide water and hydrofluoric acid, and an HF-mixed SPM production unit (14) for mixing the liquid mixture and sulfuric acid and producing HF-mixed SPM. 为了解决从基板的表面良好地去除抗蚀剂的课题，在包括旋转卡盘(5)以及向被旋转卡盘(5)保持的基板(W)供给SPM的SPM供给单元(6)的基板处理装置(1)中，所述SPM供给单元(6)具有：混合单元(30)，将过氧化氢溶液和氢氟酸混合，从而生成过氧化氢溶液和氢氟酸的混合液；以及HF混合SPM生成单元(14)，将所述混合液与硫酸混合，从而生成HF混合SPM。