LIGHTING MEANS ARRANGEMENT AND METHOD FOR PRODUCING SAME
The invention relates to a lighting means arrangement (28) and to a method for producing same. The lighting means arrangement (28) comprises at least one lighting means (20), for example a light-emitting diode chip (21) comprising at least one light emission surface (22). A cover body (24) is associ...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a lighting means arrangement (28) and to a method for producing same. The lighting means arrangement (28) comprises at least one lighting means (20), for example a light-emitting diode chip (21) comprising at least one light emission surface (22). A cover body (24) is associated with one or more lighting means, covering at least one light emission surface (22) and being connected to the lighting means (20) in a bonded manner. A scattering element arrangement (37) is associated with each of the cover bodies (24). The scattering element arrangement (37) is connected to the cover body (24) in a bonded manner, for example, using adhesion or moulding. The scattering element arrangement (37) comprises at least one coherent textile material part (38), for example a woven and/or a knitted and/or a interlaced and/or a non-woven material. The at least one textile material part (38) is used to at least partially bend and/or refract and/or reflect and/or absorb the light coupled into the cover bo |
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