Organic silicon bonding glue, method for applying same and application of organic silicon bonding glue

The invention provides organic silicon bonding glue, a method for applying the same and application of the organic silicon bonding glue. The organic silicon bonding glue comprises a component A and a component B. The component A comprises methyl vinyl polysiloxane, hydrophobic white carbon black, cross-linking agents, heat conduction fillers, treating agents, inhibitors and tackifiers; the component B comprises methyl vinyl polysiloxane, hydrophobic white carbon black, heat conduction fillers, treating agents, catalysts and tackifiers. The organic silicon bonding glue, the method and the application have the advantages that the organic silicon bonding glue can be effectively bonded with electronic power devices after being solidified, and accordingly the waterproof, dustproof and damp-proof performance of the electronic power devices can be greatly improved; crack between the electronic power devices and the organic silicon bonding glue due to current fluctuation can be prevented, and accordingly the service