Low temperature-resistant hot melt adhesive used for sealing case and preparation method thereof

The invention relates to the technical field of a chemical modification high-molecular material, and concretely relates to a low temperature-resistant hot melt adhesive used for sealing a case and a preparation method thereof. The hot melt adhesive comprises the following raw materials in parts by weight: 38-42 parts of EVA resin with a melt index of 45, 10-12 parts of Fischer Tropsch wax, 7-9 parts of paraffin, 17-19 parts of terpene resin, 20-24 parts of rosin resin, and 0.5-1.5 parts of an anti-oxidant. The hot melt adhesive employs the Fischer Tropsch wax and paraffin through complex formulation, then combines complex formulation of terpene resin and rosin resin, and selects the EVA resin with the melt index of 45, so that the Fischer Tropsch wax, paraffin, the terpene resin and the rosin resin are subjected to mutual synergistic interaction effect, the low temperature resistant performance of the hot melt adhesive is obviously increased, and the prepared hot melt adhesive keeps excellent bonding property