Substrate holding apparatus

The purpose of the present invention is to provide a substrate supporting device capable of preventing a process defect caused by bending of a substrate by minimizing a thermal loss by thermal transfer between the substrate and a support plate for supporting the substrate when a reflow process for manufacturing a single system (SoC) using an epoxy molding compound (EMC) substrate is performed. The substrate supporting device of the present invention to achieve the purpose, which is a substrate supporting device for fixating and supporting an epoxy molding compound substrate when a reflow process for manufacturing a single chip system (SoC) is performed, comprises: a support plate provided in the chamber in which the substrate is thermally treated to be lifted to support the substrate; and a plurality of substrate support members which are provided on the support plate at regular intervals, support the mounted substrate, and are made of an insulating material for blocking heat transfer between the heat-treated