Method for producing an electronic component

A method for producing an electronic component comprises steps for providing a surface that has a first region (110) and a second region (120) adjacent to the first region, for arranging a sacrificial layer (200) over the first region of the surface, for arranging a passivation layer (300) over the sacrificial layer and the second region of the surface, for making an opening (410) in the passivation layer over the first region of the surface and for removing the sacrificial layer (200). For this purpose, a photoresist layer (400) may also be used. After masking and etching the sacrificial layer, the remaining photoresist layer (400) and the overhang of the passivation layer (300) can be mechanically removed by way of a thus-formed predetermined breaking point. 种用于制造电子组件的方法，包括用于以下的步骤：提供具有第区（110）和邻近第区的第二区（120）的表面；在表面的第区之上布置牺牲层（200）；在牺牲层和表面的第二区之上布置钝化层（300）；在表面的第区之上的钝化层中制作开口（410）；以及移除牺牲层（200）。为此目的，还可以使用光致抗蚀剂层（400）。在掩蔽和蚀刻牺牲层之后，可以通过因而形成的预定断裂点机械移除剩余的光致抗蚀剂层（400）和钝化层（300）的悬垂部分。