Electronic assembly and method for the production thereof

The invention relates to an electronic assembly (E) comprising: a carrier element (1), a circuit carrier (3) having a number of electronic components (4), a circuit board (6), which is electrically conductively connected to the circuit carrier (3), and a covering element (2) for covering the circuit carrier (3), the covering element (2) being arranged on one flat side of the circuit board (6) and the carrier element (1) being arranged on an opposite flat side of the circuit board (6). According to the invention, the circuit board (6) is welded respectively to the carrier element (1) and to the covering element (2). The invention further relates to a method for producing such an electronic assembly (E). 本发明涉及种电子部件(E)，该电子部件包括：个载体元件(1)，个具有多个电子构件(4)的电路载体(3)，个与该电路载体(3)导电地连接的导体板(6)，以及个用于覆盖该电路载体(3)的覆盖元件(2)，其中该覆盖元件(2)安排在该导体板(6)的个平面侧上并且该载体元件(1)安排在该导体板(6)的个对置的平面侧上。根据本发明提出，该导体板(6)分别与该载体元件(1)和该覆盖元件(2)焊接。本发明还涉及种用于生产此类电子部件(E)的方法。