Ethernet magnetics package wire terminations

In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHAU KI-YUEN, CURTIS GEORGE, LIN KAYEN, THARP KEITH FRANK, EDWARDS WILLIAM FRANK
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base. 在个实施例中,种装置被配置为帮助制造或组装电子表面贴装封装。该装置包括用于支撑共模扼流圈的共模扼流圈基底。该装置包括被耦合至共模扼流圈基底的端子触点。端子触点与连接到共模扼流圈的导线对准。该装置包括支撑组件,该支撑组件包括与连接到共模扼流圈的导线对准的导线支撑部分和被配置为支撑共模扼流圈基底的中心部分。