A wire coating apparatus, system and method
A wire coating device comprising: a chamber having an electrolytic fluid therein, said chamber arranged to allow the passage of a wire through said chamber; a magnetising device for applying a magnetic field to said wire; at least one anodic electrode within said chamber; a cathodic electrical conne...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A wire coating device comprising: a chamber having an electrolytic fluid therein, said chamber arranged to allow the passage of a wire through said chamber; a magnetising device for applying a magnetic field to said wire; at least one anodic electrode within said chamber; a cathodic electrical connection in electrical communication with said wire; a grit supply for introducing a supply of metal coated grit into the chamber; wherein the wire is arranged to magnetically attract the metal coated grit, with the anodic electrode and cathodic wire arranged to electrolytically apply a metal coating to said wire to encase said metal coated grit.
种线材涂覆装置,包括:腔室,其中具有电解流体,所述腔室被配置为允许线材通过所述腔室;磁化装置,用于对所述线材施加磁场;所述腔室内的至少个阳极电极;与所述线材电连通的阴极电连接;沙砾供应部,用于将涂覆有金属的沙砾的供应引入所述腔室中;其中所述线材被配置为磁性地吸引所述涂覆有金属的沙砾,并且所述阳极电极和阴极线材被配置为以电解的方式将金属涂层施加到所述线材以包裹所述涂覆有金属的沙砾。 |
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