Silicone pressure sensitive adhesives
The invention provides a process for the production of a pressure sensitive adhesive, comprising dissolving a particulate solid MQ silicone resin having a bulk density in the range 0.4 - 0.9 g/cm3 in a volatile solvent, and dissolving a polydiorganosiloxane having a viscosity of 0.1 to 40,000 Pa.s a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a process for the production of a pressure sensitive adhesive, comprising dissolving a particulate solid MQ silicone resin having a bulk density in the range 0.4 - 0.9 g/cm3 in a volatile solvent, and dissolving a polydiorganosiloxane having a viscosity of 0.1 to 40,000 Pa.s at 25 DEG C in the volatile solvent before, simultaneously with or after dissolving the solid MQ silicone resin. The process of the present invention allows the production of a pressure sensitive adhesive in a solvent different from the solvent in which the MQ silicone resin was prepared.
本发明提供种用于制备压敏粘合剂的方法,所述方法包括将具有在0.4-0.9g/cm范围内的堆积密度的粒状固体MQ有机硅树脂溶解在挥发性溶剂中,以及在溶解固体MQ有机硅树脂之前、同时或之后,将在25℃下具有0.1至40,000Pa.s粘度的聚二有机硅氧烷溶解在挥发性溶剂中。本发明的方法允许在与制备MQ有机硅树脂的溶剂不同的溶剂中制备压敏粘合剂。 |
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