Thermosetting resin composition, dry film, cured product and printed wiring board

A thermosetting resin composition having improved performance, a dry film, a cured product and a printed wiring board are provided. This thermosetting resin composition contains (A) a bisphenol E type epoxy resin, (B) a curing agent and/or a curing accelerator, and (C) a filler. This dry film has a...

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Bibliographische Detailangaben
Hauptverfasser:	NOGUCHI TOMOTAKA, CHUJO TAKAYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A thermosetting resin composition having improved performance, a dry film, a cured product and a printed wiring board are provided. This thermosetting resin composition contains (A) a bisphenol E type epoxy resin, (B) a curing agent and/or a curing accelerator, and (C) a filler. This dry film has a resin layer obtained by coating and drying the aforementioned thermosetting resin composition, this cured product is obtained by curing said dry film, and this printed wiring board comprises said cured product. 本发明提供具备比以往更优异的性能的热固化性树脂组合物、干膜、固化物和印刷电路板。种热固化性树脂组合物，其含有：(A)双酚E型环氧树脂、(B)固化剂和固化促进剂中的任者或两者、和(C)填料。提供具有将上述热固化性树脂组合物涂布到薄膜上并使其干燥而得到的树脂层的干膜、使其固化而得到的固化物、具有该固化物的印刷电路板。