Manufacturing method of bendable rigid printed circuit board

The invention discloses a manufacturing method of a bendable rigid printed circuit board. The manufacturing method comprises the following steps of 1, performing structural design of a multilayered circuit board, designing a blind groove region, a depth target layer and a bending region in the middle part of the circuit board from the top to bottom in sequence; 2, performing graph manufacturing of an inner layer circuit of the circuit board, and laminating; 3,carrying out hole drilling and electroplating, and then performing graph manufacturing of an outer layer circuit of the circuit board; 4, performing ink printing on the upper and lower surfaces of the circuit board; and 5, performing depth-control milling for the first time, taking a position which is 15-20[mu]m above the depth target layer as the set target depth of depth-control milling equipment, wherein a blind groove manufactured by depth-control milling for the first time is 50-80[mu]m smaller than the two edges of the bending region separately to