Epoxy resin pouring sealant and preparation method thereof

The present invention relates to an epoxy resin pouring sealant and a preparation method thereof, the epoxy resin pouring sealant includes A and B components, the A component includes, by weight, 40-70 parts of bisphenol F epoxy resin, 20-50 parts of an active polyurethane toughening agent, 10-20 parts of an active diluent, 30-50 parts of an inorganic filler and 1-10 parts of an additive; the B component includes, by weight, 40-70 parts of modified alicyclic amine; 30-60 parts of polyetheramine and 3-10 parts of a promoter. The weight ratio of A to B is 2-4:1. The epoxy resin pouring sealant has better aging resistance and strong resistance to cold and hot impact, and meets the high temperature and cold impact requirement of electronic sealing. 本发明是关于种环氧树脂灌封胶及其制备方法，其环氧树脂灌封胶，包括A组分和B组分，其中：A组分以重量份数计，包括：双酚F环氧树脂40-70份，活性聚氨酯增韧剂20-50份，活性稀释剂10-20份，无机填料30-50份，助剂1-10份；B组分以重量份数计，包括：改性脂环胺40-70份；聚醚胺30-60份；促进剂3-10份；A组分和B组分的重量比为2-4:1。本发明的环氧树脂灌封胶具有较好的耐老化能力，且抗冷热冲击能力强，满足对冷热冲击要求较高的电子灌封需求。