Novel board-to-module connecting structure

The invention discloses a novel board-to-module connecting structure. The novel board-to-module connecting structure comprises a shell for shielding, a first conductor, a cover plate for shielding, a PCB, a second conductor and a third conductor, wherein the first conductor is fastened inside the sh...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GAO FEI, ZHENG GUANGYE, CAI LEI, XUE PENG, JIANG WEI, WANG HAIYING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a novel board-to-module connecting structure. The novel board-to-module connecting structure comprises a shell for shielding, a first conductor, a cover plate for shielding, a PCB, a second conductor and a third conductor, wherein the first conductor is fastened inside the shell, a first clamping part is arranged at the end of the first conductor; the cover plate is of a hollow cavity structure, and openings are formed in two ends of the cover plate; the second conductor is connected onto the PCB, the PCB covers the opening end on one side of the cover plate so that the second conductor is arranged inside the cover plate, and a second clamping part is arranged at the end of the second conductor; the third conductor is provided with two ends, one end of the third conductor is fastened and clamped on the first clamping part, and the other end of the third conductor is fastened and clamped on the second clamping part so that the opening end on one side of the cover plate abuts against the