Cooling liquid for diamond wire cutting silicon wafers

The invention relates to water-based cooling liquid for diamond wire cutting and a preparation method of the cooling liquid. The water-based cooling liquid for diamond wire cutting comprises, by weight, 99.8-99.95 parts of water, 0.01-0.07 part of wetting agents, 0.01-0.07 part of emulsifying and dispersing agents, 0.01-0.05 part of defoaming agents and 0.001-0.015 part of metal inhibitors. The water-based cooling liquid for diamond wire cutting changes a traditional technique that monocrystalline silicon wafers and polycrystalline silicon wafers are cut through a diamond wire by the aid of oil-based cooling liquid, yield is increased, and the content of water in cutting liquid reaches 99% or more, so that cutting cost is greatly reduced. 本发明涉及种用于金刚石线切割的水基冷却液及其制备方法。所述用于金刚石线切割的水基冷却液包含99.8-99.95重量份的水、0.01-0.07重量份的润湿剂、0.01-0.07重量份的乳化分散剂、0.01-0.05重量份的消泡剂和0.001-0.015重量份的金属抑制剂。本发明所述的用于金刚石线切割的水基冷却液改变了传统的用油基冷却液进行金刚线切割单多晶硅片技术，在提升良率的同时，使切割液水含量达到99％以上，从而大大降低了切割成本。