Packaging structure

A packaging structure comprises a substrate having a plurality of conductive traces and electronic elements located on a portion of the conductive traces through a plurality of conductive bumps, wherein an end surface of at least one of the conductive bumps has a long axis and a short axis which are orthogonal, and the long axis is deflected through an angle relative to an extension direction of the conductive traces so as to reduce the amount of a solder material for bonding the conductive bumps and the conductive traces, to prevent bridge connection of two adjacent conductive traces, and to prevent lack of solder. 种封装结构，包括具有多个导电迹线的基板以及通过多个导电凸块设于部分该导电迹线上的电子元件，其中至少该导电凸块的端面具有垂直相交的长轴与短轴，且该长轴相对该导电迹线的延伸方向偏转角度，藉以减少用以结合该导电凸块与导电迹线的焊锡材的用量，而避免相邻的两导电迹线发生桥接，且能避免虚焊的情况发生。