High-frequency module
On a substrate (200), a resistor (24R) is arranged between the position of an amplifier circuit (11) and the position of a duplexer (24), so coupling is suppressed in the space between the amplifier circuit (11) and the path from a main switch (26) to a receiving terminal (P24) via the duplexer (24)...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | On a substrate (200), a resistor (24R) is arranged between the position of an amplifier circuit (11) and the position of a duplexer (24), so coupling is suppressed in the space between the amplifier circuit (11) and the path from a main switch (26) to a receiving terminal (P24) via the duplexer (24). This high-frequency module (100) suppresses the aforementioned coupling even when the RX terminal (242) of the duplexer (24) is facing the amplifier circuit (11), and therefore, harmonics of the transmission signal in a low region can be kept from leaking to the receiving terminal (P24) via the path formed by said coupling. In other words, in this high-frequency module (100), it is possible to ensure the degree of freedom of board layout while avoiding reduction in the isolation characteristics in the low region and a high region.
本发明提供种高频模块，其在基板(200)上将电阻(24R)配置在放大电路(11)的位置与双工器(24)的位置之间，因此能够抑制放大电路(11)与从主开关(26)经由双工器(24)到接收端子(P24)的路径之间的空间中发生耦合。高频模块(100)即使在双工器(24)的RX端子(242)朝向放大电路(11)侧的情况下，由于能够抑制上述耦合，因此也能够防止低频带的发送信号的 |
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