Systems and methods for providing data channels at a die-to-die interface
A circuit includes a first die having a first array of exposed data nodes, and a second die having a second array of exposed data nodes, wherein a given data node of the first array corresponds to a respective data node on the second array, further wherein the first array and the second array share...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A circuit includes a first die having a first array of exposed data nodes, and a second die having a second array of exposed data nodes, wherein a given data node of the first array corresponds to a respective data node on the second array, further wherein the first array and the second array share a spatial arrangement of the data nodes, wherein the first die has data inputs and sequential logic circuits for each of the data nodes of the first array on a first side of the first array, and wherein the second die has data outputs and sequential logic circuits for each of the data nodes of the second array on a second side of the second array, the first and second sides being different.
种电路,包括具有暴露的数据节点的第阵列的第管芯、以及具有暴露的数据节点的第二阵列的第二管芯,其中,第阵列的给定数据节点对应于第二阵列上的相应数据节点,进步其中,第阵列和第二阵列共享数据节点的空间布置,其中,第管芯在第阵列的第侧上具有用于第阵列中的每个数据节点的数据输入和顺序逻辑电路,并且其中,第二管芯在第二阵列的第二侧上具有用于第二阵列中的每个数据节点的数据输出和顺序逻辑电路,第侧和第二侧不同。 |
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