Electronic component and its manufacturing method, transpose element and transposition method of microelement

An electronic component includes a circuit substrate, a connection electrode, a microelement, and a solder. The connection electrode is located on the circuit board. The connecting electrode has a first transparent conductive layer and the surface of the first transparent conductive layer is located...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU YICHENG, LI HEZHENG, LIU ZHONGZHAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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