Electronic component and its manufacturing method, transpose element and transposition method of microelement

An electronic component includes a circuit substrate, a connection electrode, a microelement, and a solder. The connection electrode is located on the circuit board. The connecting electrode has a first transparent conductive layer and the surface of the first transparent conductive layer is located on one side of the opposing circuit substrate and has a plurality of micrometer or nanoscale particles. The microelement is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the microelement, and the micro-element is fixed to the connecting electrode. 种电子组件包括电路基板、连接电极、微元件以及焊料。连接电极位于电路基板上。连接电极具有第透明导电层，且第透明导电层的表面位于相对电路基板的侧且具有多个微米或纳米级颗粒。微元件与连接电极电性连接。焊料位于连接电极与微元件之间，且固着微元件于连接电极上。