SM (sticky material) treating device

The invention discloses an SM (sticky material) treating device. The SM treating device comprises a fluid conveying pipe, a supply pipe, a die head, a supply device and at least one fluid source, wherein the supply pipe extends into the fluid conveying pipe from outside of the fluid conveying pipe; the die head is communicated with the end, located in the fluid conveying pipe, of the supply pipe and is provided with at least one forming hole; the supply device is communicated with the end, located out of the fluid conveying pipe, of the supply pipe and pushes an SM to the supply pipe, the SM is formed through the supply pipe and the die head, and the total surface area of the SM can be increased after the SM passes through the forming holes; the at least one fluid source is used for providing HF (high-temperature fluid) for the fluid conveying pipe, and the SM passing through the die head can be dried. Therefore, the heat energy use efficiency can be increased by means of the SM treating device. 本发明公开了种黏糊状物质处